ALLEGRO MICROSYSTEMS, INC. (ALGM) Business

Item 1. Business.

Our Mission

Our mission is to be the leader in global semiconductor technology with sensing and power solutions that drive electrification, automation, AI, and robotics forward.

Company Overview

The Company is a global leader in the design, development, and marketing of sensor integrated circuits (“ICs”) and application-specific power ICs that enable the sensing, motion control, and power management functions of complex electromechanical or power conversion systems. We primarily serve automotive and industrial markets, including advanced industrial markets such as AI data centers, robotics, and energy infrastructure, where our solutions enable customers to sense, move, and manage power with efficiency, precision, and reliability.

Our sensor ICs provide critical feedback for motion, position, speed, and electrical current sensing, while our power ICs control motors and manage power conversion and regulation across a wide range of applications. By embedding system-level intelligence directly into our products, we reduce the number of components required in a customer’s design while improving performance, energy efficiency, safety, and reliability. We believe our deep application knowledge, differentiated technology, and strong customer relationships enable us to deliver solutions that are more integrated, intelligent, and efficient than typical ICs.

Our portfolio includes the broadest range of magnetic sensor ICs in the industry, and we are the world’s leading supplier of magnetic sensor ICs by market share. Our portfolio includes more than 1,500 products, and we ship approximately 2.1 billion units annually to more than 15,000 customers worldwide.

Secular technology trends, including electrification, automation, AI data center expansion, and increasing energy efficiency, are driving growing demand for precision sensing and power solutions. In automotive markets, these trends are accelerating the adoption of electrified powertrains and safety-critical Advanced Driver Assistance Systems (“ADAS”), such as steering and braking systems. In industrial markets, these trends are driving greater power density, and increasing requirements for automation and thermal efficiency across AI data centers, robotics, and energy infrastructure. We believe these trends favor our differentiated sensing and power technologies and support sustained demand for our solutions.

Our technology leadership is built on decades of innovation across both magnetic sensor and power ICs. We develop highly differentiated solutions by combining proprietary circuit technologies, application-optimized packaging, and deep system-level expertise, supported by unique and proprietary wafer process technologies. Our specialized capabilities include high-temperature operation, high-speed and high-precision signal processing, and compliance with stringent automotive safety and reliability standards. These capabilities are enabled by our 120-volt (“120V”) capable Bipolar-CMOS-DMOS (“BCD”) wafer process technology, which integrates bipolar, complementary metal-oxide semiconductor (“CMOS”), and double-diffused metal-oxide semiconductor (“DMOS”) transistors on a single chip. This BCD wafer technology supports both sensing and power products and scales across multiple end markets.

This common technology foundation has enabled us to apply a consistent design and innovation blueprint across successive generations of products, establishing a strong competitive position in demanding automotive and industrial applications.

Within magnetic sensing, we offer the industry’s broadest portfolio of sensor ICs, spanning Hall-effect, giant magnetoresistive (“GMR”), and tunneling magnetoresistive (“TMR”) sensor technologies (together, “xMR”). We pioneered a systems-level approach that integrates value-added packaging elements, such as current-carrying conductors, magnets, and discrete components, along with precision analog circuits, intelligent digital logic, and calibration to develop specialized sensor ICs. This integration enables market-leading sensor ICs optimized for high-growth applications. We are among a limited number of semiconductor companies offering monolithic and high temperature rated TMR-based solutions, which provide higher sensitivity, low power consumption, and compact form factors. TMR is becoming a foundational element of our innovation strategy. An increasing percentage of new product development is focused on using TMR sensors to improve the performance or efficiency of hybrid electric vehicles (“HEV”s) and battery electric vehicles (“BEV”s) (together, “xEV”s), ADAS systems, and advanced robots.

In power ICs, we offer a comprehensive portfolio of high-performance solutions, including motor drivers, voltage regulators, isolated gate drivers (“IGD”), and power management ICs (“PMIC”s), built on our proprietary BCD process technology. We leverage a systems-level approach that integrates high-voltage power transistors with precision analog circuits, intelligent digital logic and control algorithms, and advanced power packaging, such as integrated capacitors and thermally enhanced leadframes, to develop specialized power solutions. This monolithic integration enables us to deliver market-leading efficiency, superior thermal performance, and high-temperature capability in compact form factors. We are a leader in high-voltage and high-current power ICs that incorporate embedded control algorithms to eliminate customer code development and reduce audible noise. Our power innovation strategy is increasingly

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focused on high-growth applications, where our integrated solutions improve power density and reliability in automotive, energy infrastructure, and industrial robotics.

We maintain our market leadership through deep, long-standing customer relationships, often collaborating early in the design cycle to address demanding performance, quality, and safety requirements. Our customer base includes virtually all major global automotive manufacturers, leading tier-one automotive suppliers, and a growing number of data center, automation, and robotics customers worldwide. We support customers through a global network of design, applications, and customer support centers across North America, South America, Asia, and Europe.

Our fabless, asset-light manufacturing model supports scalability, flexibility, and access to advanced manufacturing technologies to extend our market leadership. We design proprietary wafer technologies and then transfer and industrialize these technologies with external wafer fabrication partners around the globe. We also utilize a robust and scalable combination of internal and external assembly and test capabilities. To enhance regional agility and supply chain resilience, we are expanding regional supply chain capabilities, including localized manufacturing partnerships in multiple geographies, to support local customer demand and enhance overall supply chain resilience. We also maintain manufacturing relationships with Polar Semiconductor, LLC (“Polar”) in North America and various internal and external assembly and test partners across Asia to provide customers with flexibility in supply chain configurations. We believe this manufacturing strategy positions us to support long product life cycles, meet automotive-grade quality requirements, and scale efficiently across both automotive and industrial markets.

Our Market

Within the global semiconductor industry, we focus on the magnetic sensor and power IC markets, serving higher growth applications, primarily in automotive and industrial markets, including advanced industrial markets such as AI data centers, robotics, and energy infrastructure.

Automotive Focus Applications: xEV Powertrain and ADAS

We focus on vehicle electrification and automation, including xEV powertrains and the expanding adoption of ADAS. These trends are driving increased semiconductor content per vehicle and higher demand for both sensing and power solutions. The transition to electrified powertrains and 48V electrical architectures is increasing demand for our sensor and power products built on our proprietary 120V BCD process technology. Our 120V BCD-based solutions consolidate power management and protection, reducing component count and improving overall system reliability.

We are a leading provider of sensing and power solutions for vehicle electrification, building on decades of experience in powertrain efficiency and performance in conventional vehicles. Improving efficiency is critical as original equipment manufacturers (“OEMs”) seek to extend driving range, meet emissions regulations, and address heightened customer focus on environmental impact. As xEVs represent a growing share of global vehicle production, OEMs are redesigning systems to improve energy efficiency, creating opportunities for increased semiconductor content per vehicle. We believe our continued investment in research and development (“R&D”) positions us to drive both content expansion and market share gains in this high-growth focus area.

Our IGD portfolio provides additional content opportunities in xEV powertrains. Our first-to-market Power-Thru gate driver technology integrates an isolated DC-DC converter and an IGD into a single IC, reducing component count and improving efficiency compared to multi-chip solutions. This integration enables smaller printed circuit boards (“PCBs”) and more compact systems, such as on-board chargers and traction motor inverters. We continue to advance this technology to support high-voltage gallium nitride (“GaN”) and silicon carbide (“SiC”) solutions used in xEV power conversion systems.

Industry experts see ADAS adoption continuing to expand across vehicle classes globally, driven by demand for safety and automation features. Our sensor and power ICs are used in steering and braking systems that enable functions such as collision avoidance, lane-keep assist, automatic emergency braking, and self-parking. Even modest levels of automation utilize products across our portfolio, including sensors, PMICs, and motor drivers. We believe that our content per ADAS system will increase as ADAS architectures evolve from electric power steering to steer-by-wire systems and from electro-hydraulic braking to electro-mechanical braking systems. As these ADAS architectures become more sophisticated, more semiconductor content is required per system. While we are positioned for this long-term shift toward higher automation, we are currently capturing significant value in the existing market. Today, our solutions are already widely deployed in Level 1 and 2 ADAS systems across both xEV and internal combustion engine (“ICE”) vehicles, allowing us to participate in ADAS growth without reliance on full vehicle autonomy.

TMR technology, marketed under the XtremeSense™ brand, strengthens our sensor portfolio and is a pillar of our innovation strategy. TMR enables higher sensitivity, lower power consumption, faster response times, and smaller form factors compared to other magnetic technologies. TMR solutions are well-suited to support high-accuracy sensing in electric powertrains and safety-critical steering and braking systems.

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Other Automotive Applications

ICE powertrains are expected to persist for the foreseeable future, either as standalone systems or as part of HEVs. OEMs continue to pursue improved fuel efficiency and reduced vehicle emissions. We remain a proven supplier supporting these objectives through decades of experience in ICE powertrain applications.

Our safety, comfort, and convenience business, commonly referred to as body electronics, continues to evolve alongside vehicle electrification. xEVs incorporate a growing number of motors, pumps, and fans, often in air or liquid cooling systems, thereby increasing our content opportunity per vehicle. We also enable safer and more energy-efficient interior and exterior lighting systems through continued innovation in LED driver products developed in close collaboration with customers.

Industrial Focus Applications: AI Data Center, Automation, and Robotics

The emergence of AI data centers is driving increased demand for our sensor and power ICs in both cooling and power supply applications. Our motor drivers are widely used in data center cooling systems, including fans and pumps, to provide air or liquid cooling of digital processors, power supplies, or network switches. Our fully integrated motor drivers reduce the number of components needed, lower energy consumption, and improve thermal efficiency.

In data center power supplies, our current sensor ICs improve efficiency and power density in power conversion systems, particularly as architectures transition to higher operating voltages such as 48V and 800V. Our galvanically isolated current sensors are well suited for these environments. We believe demand for our Hall-effect and TMR current sensors ICs will increase as data center power density requirements rise.

IGDs are also gaining traction in data center applications. Our compact, single-package gate driver solutions improve power density and efficiency and shrink the overall size of power conversion systems.

This momentum is reflected in our fiscal year 2026 performance, as data center sales represented an increasing percentage of our total revenue. Both motor drivers and current sensors contributed to fiscal year 2026 sales, while IGDs are being sampled and tested by customers for the next generation of data centers.

Factory automation and robotics represent additional high-growth opportunities driven by demand for precise motion control and energy-efficient systems. Robotics applications, including warehouse, industrial, collaborative, and humanoid robots, require high-accuracy, reliability, and safety specifications that align closely with our automotive ADAS heritage. We believe we are well positioned to leverage synergies across our sensor and power portfolios, including motor drivers as well as current, position, and angle sensors, to expand our presence in these emerging markets. Industrial customers value our rigorous quality standards and devices designed to perform reliably over long product lifecycles.

Other Industrial Markets

The other industrial markets comprise energy infrastructure, personal mobility, power tools, heavy transport equipment, medical, and consumer applications.

Energy infrastructure growth is being driven by the increased electrification of a variety of products and processes, government regulations to reduce emissions, and the rising power demands of AI data centers. Applications, including solar inverters, xEV charging infrastructure, and grid infrastructure seek the same efficiency and power density as xEVs. We enable more efficient use of grid-delivered power by supporting higher-voltage, higher-efficiency power architectures that reduce losses between the grid connection and the point of load. By deploying XtremeSense™ TMR current sensors and integrated power ICs, we enable smarter, more efficient power conversion and fault detection. These ICs are essential for managing the extreme load fluctuations and bidirectional energy flows inherent in the “Age of Electricity.” Our technology allows grid infrastructure to support significantly higher power densities while reducing energy waste.

Personal mobility applications, including two-wheelers, are experiencing electrification trends similar to larger automobiles and require compact, high-performance solutions with long product lifecycles. Our automotive-grade quality standards provide industrial customers with robust, high-performance solutions that have earned trust across markets.

Consumer applications include smart home products, gaming equipment, power tools, and personal medical devices. Our low-power XtremeSense™ TMR and Hall-effect sensors, along with efficient motor drivers, enable more energy-efficient consumer products with extended battery life.

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Market Opportunity and Served Available Market (“SAM”)

Within our target markets, our growth opportunity extends beyond unit deployment and is increasingly driven by structural market shifts and long-term megatrends that expand semiconductor content per system. These trends include electrification, automation, AI data centers, and robotics, each of which is driving higher system power, greater architectural complexity, and increased requirements for sensing, control, and power management. As these markets evolve, growth is increasingly defined by rising content per system rather than unit volumes alone, expanding our SAM even in periods of moderated end-market growth.

Across these target automotive and industrial markets, our sensor and power ICs are frequently deployed together to deliver complete solutions for precision motion control and efficient power management. These integrated solutions enable smaller, more efficient electric motors, improved power density, enhanced safety, and reduced total system cost, while supporting increasing semiconductor content per system in our target applications.

We are a market share leader in magnetic sensor ICs and believe there is an opportunity to grow this foundational business by aligning our portfolio with the highest growth applications within magnetic sensing. The transition to xEVs, ADAS, AI data centers, and robotics is driving demand for precise, high-bandwidth current and position sensing to enable efficient power conversion and motor control, as well as compliance with increasingly stringent performance and safety requirements. Our XtremeSense™ TMR technology underpins differentiated products, including industry-leading 10 MHz current sensors designed to support fast-switching GaN and SiC power devices. As system architectures evolve, specifically through the transition to electro-mechanical braking in vehicles and the build-out of high-power AI data centers, the sensing intensity per system is increasing in both volume and value, resulting in content gains. Adoption of TMR and inductive angular position sensors is also increasing to enable precise motion control in ADAS and robotics systems.

We are also expanding our power IC portfolio to increase content in automotive and industrial applications where electrification and energy efficiency are driving design changes. xEVs require a growing number of motors to support pumps, fans, and safety-critical systems. Next-generation vehicle architectures, such as electro-mechanical braking and steer-by-wire, meaningfully increase power IC semiconductor content per system. In parallel, AI data centers continue to evolve toward higher rack power, increased airflow requirements, and advanced liquid cooling solutions. These shifts increase demand for efficient motor drivers and power solutions while enabling content growth that scales faster than end-market unit volumes.

We also see an opportunity to expand our presence in IGDs as power conversion architectures evolve across xEVs, AI data centers, and energy infrastructure. The accelerating adoption of SiC and GaN power devices reflects customer demand for higher efficiency, smaller system size, and improved thermal performance. Our IGDs are designed to enable efficient, reliable operation of these next-generation power systems, supporting higher power throughput and contributing to meaningful increases in semiconductor content per system.

The same content expansion dynamics are emerging across industrial automation and robotics. As robots become more capable and are deployed at greater scale, systems will increasingly require multiple motors, precise position sensing, and advanced power management within each joint and subsystem. These increasing per system requirements create opportunities for multiple Allegro devices within a single robotic platform and represent an additional long-term expansion of our SAM.

Company Strategy

Our strategy is built on delivering high-performance, differentiated IC solutions that solve our customers’ most complex challenges. By innovating with purpose, we extend our leadership in high-growth target markets. We are committed to expanding our global footprint to remain a premier provider of semiconductor power and sensing solutions, driving the next generation of motion control and energy-efficient systems across the automotive and industrial landscape.

Invest in R&D that is market-aligned and focused on targeted portfolio expansion

We believe continued investment in R&D across product design, automotive-grade wafer technology, and advanced IC packaging is critical to maintaining our competitive position. Structural technology shifts in automotive and industrial markets, including xEV, ADAS, AI data centers, and robotics, are driving demand for higher intelligence, greater energy efficiency, and more complex system architectures that align closely with our core competencies. Our deep understanding of customer end systems has enabled us to expand our sensor IC and power portfolios to address these evolving requirements. By aligning our R&D investments with high-growth technology trends and subjecting programs to disciplined return on investment (“ROI”) evaluation, we believe we can support sustained growth while maintaining attractive financial performance. A smaller portion of R&D investment is allocated to an in-house incubator with a higher risk-reward profile that explores new technologies with the potential to contribute significantly to Allegro’s long-term revenue.

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Build on our automotive heritage to align our product development with the most rigorous applications and reliability expectations

We are a leading supplier of magnetic sensor and power ICs to the automotive market due to our deliberate focus on designing products to meet stringent automotive operating voltages, temperature ranges, and safety and reliability standards across the full product lifecycle, from design through manufacturing. By developing products from the outset to operate reliably in high-temperature and high-voltage environments, we have established a strong technical reputation with automotive OEMs and tier-one suppliers.

We believe our approach of using automotive standards as the baseline for product development positions us well as customers seek trusted suppliers to support increasingly complex and safety-critical systems, particularly in rapidly growing areas such as xEV powertrains and ADAS. These applications require higher performance, greater reliability, and longer product lifecycles, creating meaningful investment requirements for new competitors.

We leverage this automotive-grade expertise to address growing demand from industrial customers for rugged, high-reliability solutions in applications such as AI data centers, factory automation, and robotics. In our experience, products that meet or exceed stringent safety and reliability requirements tend to command higher average selling prices (“ASPs”) and exhibit slower ASP erosion over time compared to typical industry products.

Invest to lead in chosen markets and apply our intellectual property (“IP”) and technology to pursue adjacent growth markets

We intend to continue investing in technology development and our IP portfolio to maintain leadership in magnetic sensor ICs and expand our competitive position in power ICs across our target markets. We seek to maximize the return on these investments by leveraging proven technologies and existing R&D, sales, and support infrastructure to address adjacent, high-growth market opportunities with strong technical and customer overlap.

We apply our patented sensor and power-related IP to support increasing electronics content in automotive applications driven by the adoption of electrified powertrains and advanced safety systems. We are also investing in advanced current sensing, IGD, and sensorless motor control technologies to address AI data center applications, where rising power density and efficiency requirements align closely with our core capabilities. In addition, we are aligning our application domain expertise, smart sensor design, and power management and motor control algorithms to support the growing demand for electronics in industrial automation and robotics.

We believe this strategy of extending core technologies into adjacent markets enables us to expand our SAM while achieving higher returns on our R&D investments.

Sales operations and customer relationships

We sell our products globally through a combination of a direct sales force, distributors, and independent sales representatives. Our global sales infrastructure is designed to support customers through key account managers and regional technical and support centers located near customer operations. These centers enable us to work closely with customers as an extension of their design teams, providing early insight into system requirements and accelerating product adoption and ramp-up in customer designs.

We intend to continue to strengthen relationships with existing customers while enabling our channel partners to play a greater role in demand generation, customer support, and fulfillment for smaller, broad-based industrial customers. We believe expanding the role of our channel will allow us to further penetrate industrial markets and scale our business efficiently.

Our approach to the Chinese market emphasizes localized engineering engagement to drive innovation, regional supply chain capabilities, and close co-development with domestic OEMs, enabling deep customer partnerships and design wins based on our differentiated technology.

During fiscal year 2026, we reorganized our internal sales force to align by end market rather than geography. We believe this will further support sales growth across automotive and industrial markets.

Improve our gross margins through product innovation and cost optimization

We seek to improve profitability by introducing differentiated products with value-added features while reducing manufacturing costs through our fabless, asset-light operating model. We expect to continue enhancing our product mix by developing new products for growth markets where we believe we can generate higher ASPs and/or gross margins.

We also intend to deepen relationships with key foundry and manufacturing partners to apply our products and applications expertise in developing differentiated, cost-efficient wafer processes and packaging technologies. By leveraging the advanced manufacturing capabilities of our strategic suppliers, adopting more cost-effective packaging solutions, and optimizing the mix of internal and external assembly and test capacity, we believe we can reduce manufacturing costs, limit capital requirements, enhance supply reliability, and support continued growth.

We intend to continue selecting leading manufacturing partners to maintain product quality, ensure continuity of supply, and protect our IP.

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Selectively pursue acquisitions and other strategic transactions

We evaluate and selectively pursue acquisitions and transactions as an integral part of our strategy to supplement organic growth. We focus on acquisitions that we believe will accelerate our growth in strategic focus areas, complement our expertise and customer base, and be accretive to our target financial models. Historical examples include our acquisitions of Crocus Technology International Corp. and Heyday Integrated Circuits.

Maintain sustainability efforts

We will continue to innovate with purpose, aiming to help address critical global challenges related to energy efficiency and vehicle emissions, as well as clean and renewable energy with our sensing and power management product portfolio. In addition, we strive to operate our business in a socially responsible and environmentally sustainable manner, with the goals of reducing costs, maintaining a dedication to social responsibility in our supply chain, and disclosing the environmental impact of our business operations.

Company Products and Solutions

Our product portfolio includes over 1,500 products across a range of high-performance analog mixed-signal semiconductors. We apply our deep technology know-how to deliver magnetic sensing IC and power IC solutions to:

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Sense speed, position, angle and current to enable critical safety features in ADAS and optimize power density and efficiency in xEVs to extend driving range. Beyond the automotive market, our technologies enhance the performance and energy efficiency of AI data centers, factory automation, robotics, and energy infrastructure;

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Regulate complex vehicle systems and manage high-voltage power through integrated PMICs and IGDs to enhance functional safety and power efficiency. Our solutions are engineered to significantly increase power density, thereby reducing overall system footprint, minimizing the use of raw materials, and lowering total system cost for our customers; and

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Drive high-performance motors using our advanced motor drivers, powered by proprietary algorithms that deliver industry-leading reliability and energy efficiency. These solutions provide the precision control required for smooth operation with minimal audible noise and vibration, essential for both in-cabin motors for premium xEVs and the high-speed accuracy required of robotics.

Magnetic Sensor ICs

We offer what we believe to be the industry’s leading portfolio of magnetic sensor ICs. Our solutions are based on our monolithic Hall-effect, GMR and TMR technologies, which allow customers to develop contactless sensor solutions that reduce mechanical wear and provide greater measurement accuracy and system control. Our portfolio of magnetic sensor ICs includes the following:

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Current Sensor ICs: Current sensor ICs measure current by detecting the magnetic field generated by a current carrying conductor. We offer a broad portfolio of current sensors designed to support a wide range of voltages and applications, enabling customers to monitor and protect electronic systems while improving energy efficiency. These products are used across automotive and industrial markets, including on-board chargers, DC-DC converters, inverters, industrial motors, solar inverters, robotics, AI data center power supplies and xEV charging infrastructure. Our XtremeSense™ TMR based current sensors deliver industry leading bandwidth, enabling high-performance SiC- and GaN-based power conversion in high voltage systems such as AI data centers and energy infrastructure.

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Position Sensor ICs: Position sensor ICs provide high-precision analog or digital outputs to measure magnetic field intensity, establishing the exact position or angle required for complex motion control. These solutions are fundamental to the functional safety of ADAS power steering and braking systems, as well as the high-speed synchronization of xEV traction motors. By leveraging our proprietary XtremeSense™ TMR technology, we provide industry-leading resolution and advanced safety diagnostics essential for mission-critical motor position sensing in autonomous and electrified platforms. While these high-performance sensors continue to optimize the efficiency of advanced transmission and powertrain systems in traditional ICE vehicles to meet global emissions standards, our innovation is increasingly focused on the next generation of safe and sustainable mobility.

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Speed Sensor ICs: Our high-precision speed sensor ICs and advanced high-performance xMR solutions provide critical digital data on rotation and direction for the next generation of safe, electrified, and automated mobility. These sensors can be essential for the functional safety of ADAS braking systems and the precise motion control required in industrial robotics. While our proprietary algorithms continue to support traditional powertrain optimization to meet global emissions standards, our portfolio is increasingly centered on enabling the autonomous and electrified future.

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Power ICs

Our power IC portfolio includes high-temperature and high-voltage capable motor driver ICs, DC-DC voltage regulators, safety PMICs, LED driver ICs, and high-voltage IGDs. These power ICs allow our customers to design safer, smaller, and more power-efficient systems. We employ embedded algorithms that reduce the need for external software development, reduce audible noise, and increase start-up reliability in BLDC motors and fans. Our portfolio of power ICs includes the following:

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Motor Driver ICs: Motor driver ICs contain the power drivers and the sequencing logic to drive the coils of a variety of motors. Our motor driver ICs utilize embedded algorithms to improve energy efficiency and motion control in various automotive motors, pumps, and fans. Our ICs also spin AI data center cooling fans and pumps, as well as motors for robotics, factory automation, medical devices, and home appliances.

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Regulators, Safety PMICs and LED Driver ICs: Our portfolio of regulator ICs and PMICs is used extensively for DC-DC power conversion in advanced ADAS and powertrain systems. Our LED driver ICs and modules are used in smart automotive lighting systems to improve efficiency and reduce solution size.

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IGDs: These devices typically combine an isolated DC-DC power supply and high-voltage gate drivers into a single package. They are designed to drive GaN and SiC switches in high-efficiency power conversion systems. Our IGDs enable applications that are smaller and more efficient than competing solutions, helping to shrink PCBs and reduce total system size and raw materials used in AI data centers, xEV powertrains, and energy infrastructure.

Examples of our IC products and their applications in end markets are set forth in the following table.

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Sustainability Initiatives

Our commitment to “Innovation with Purpose” is a core value that includes operating responsibly and sustainably. Our engineers are developing innovative solutions that address critical customer needs, such as improving efficiency in automotive and industrial systems and supporting the transition to more sustainable energy solutions. We believe that integrating ESG considerations into our business strategy is essential for long-term value creation and meeting the evolving expectations of our stakeholders, including our customers. We recognize that the regulatory landscape surrounding environmental and social issues is dynamic, and our approach may evolve over time as regulations and stakeholder expectations change.

Our ESG strategy is advanced through our five signature initiatives focused on our products, environmental impacts, supply chain, communities, and workforce. At the core of these initiatives is maximizing the positive impact of our products. We believe our ICs help address global challenges related to carbon dioxide (“CO2”) emissions, energy efficiency, and renewable energy across a variety of applications. For example, our products:

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Improve energy efficiency in HEVs and BEVs;

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Reduce vehicle emissions and improve fuel economy for ICE vehicles;

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Bolster energy efficiency in next generation data center infrastructure; and

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Enable energy management that is instrumental in renewable and smart energy applications.

In response to customer demand and as part of the Company’s aim to reduce costs and the environmental impact of our products throughout their lifecycle, we are investing in innovation while measuring and tracking emissions, waste, and water usage across our facilities. The Company has implemented several energy, water, and waste reduction projects at our sites. We also strive to adhere to international standards and regulations regarding manufacturing processes, business procedures, and product composition. Our Scope 1 and Scope 2 emissions, energy use, waste data, water consumption, and other key ESG metrics are publicly disclosed in our annual ESG Report and Carbon Disclosure Project questionnaires on climate change and water security and are available at www.allegromicro.com. Please note that the content on our website and in our ESG Report is not part of, nor incorporated by reference, into this Annual Report.

The Company is a member of the Responsible Business Alliance (“RBA”), the world’s largest industry coalition dedicated to corporate social responsibility in global supply chains. The Company’s subcontractors and direct materials suppliers must complete and sign the Company’s Supplier Code of Conduct, which addresses labor and human rights, worker health and safety, and environmental standards in alignment with the RBA. In the Company’s Supplier Code of Conduct, subcontractors and direct materials suppliers attest to holding ISO 14001 and ISO 45001 (or comparable) certifications or having a plan to become certified.

To support our commitment to ESG, we have established a cross-functional team led by our legal department to manage our ESG program (the “ESG Steering Committee”). Our ESG Steering Committee consists of key team members from various departments throughout the Company who are responsible for providing oversight of ESG risks and opportunities, guiding the Company through our multi-year ESG goal setting and roadmap implementation, and promoting supplier compliance with our global sustainability efforts. In addition, our ESG team updates senior management and the Nominating and Governance Committee of our Board of Directors (the “Board”) on a quarterly basis regarding ESG target setting, progress, risks, opportunities, regulatory preparedness, and other key focus areas. An ESG update is also provided annually to our full Board.

Sales, Marketing and Customer Support

We sell our products worldwide through multiple sales channels, including through our direct sales force, distributors and independent sales representatives, who resell our products to numerous end customers. We have a geographically diverse mix of sales. Our net sales made to distributors were approximately 55.0%, 50.7% and 52.9% of our net sales in fiscal years 2026, 2025 and 2024, respectively. Sales to our largest, non-affiliated distributor accounted for 9.4%, 9.3%, and 10.2% of our net sales in fiscal years 2026, 2025 and 2024, respectively.

Our direct sales force and field applications engineers provide our customers with specialized technical support. We believe that maintaining a close relationship with our customers and serving their specific technical needs improves their level of satisfaction and enables us to predict and influence their future product needs. We provide ongoing technical training to our distributor and sales representatives to keep them informed of our existing and new products.

We maintain an internal marketing organization that is responsible for increasing our brand awareness, promoting our products to prospective and existing customers, and driving demand for our products in the market. Our marketing organization’s responsibilities include the creative management of our website, market research and analytics, and development of demand generation strategies and materials, such as product announcements, press releases, brochures, training and videos, as well as securing thought leadership through published technical and trend articles and advertisements, and active engagement in key industry events and conferences.

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Manufacturing and Raw Materials

Our fabless manufacturing strategy consists of a combined internal and external sourcing model. We operate as a fabless company for semiconductor wafer fabrications, relying entirely on third-party foundry partners. For our back-end manufacturing, we use a combination of internal and external resources. Our facility in the Philippines (“AMPI”) serves as our primary internal assembly and testing site. We supplement AMPI’s capacity with a network of external subcontractors located throughout the world. Additionally, we are expanding our regional manufacturing footprint by qualifying additional wafer foundries and outsourced semiconductor assembly and test (“OSAT”) partners in Asia, which enhances supply chain resilience and supports continuity of service to our regional customers.

Our manufacturing processes use raw materials, including silicon wafers, laminate substrates, lead frames, gold and copper wires, rare earth materials, including samarium used in our magnetic sensors, and molding compounds. We seek to obtain these materials from our suppliers in a timely manner to align our production with customer demand. We work closely with our key third-party suppliers, providing rolling forecasts to help ensure an adequate supply of materials and wafer capacity. However, these suppliers may extend lead times, limit supplies, or increase prices due to factors beyond our or their control, including geopolitical and international trade restrictions. Our reliance on this hybrid manufacturing model and our supply chain involves a number of risks, which are described in more detail under “Item 1A. Risk Factors.”

Customers

We sell our products to major global OEMs and their key suppliers, primarily in the automotive and industrial markets. We sold to more than 15,000 end customers, directly and through distributors, during each of fiscal years 2026, 2025 and 2024. Approximately half of our net sales during each of fiscal years 2026, 2025 and 2024 were derived from sales to our top 20 customers, which includes distributors. No end customer, including those served through our distributors, exceeded 10% of our net sales during fiscal years 2026, 2025 and 2024.

Research and Development Strategy

We are a technology company, and we believe our future success depends on our ability to rapidly develop and introduce differentiated new products in our target markets. As a result, we are committed to investing in our process and product development capabilities while focusing our engineering efforts on designing and introducing new application-specific products, developing new semiconductor process and packaging technologies, enhancing design productivity and evaluating new technologies. Our research and development investments are subject to a rigorous ROI review to ensure alignment with our growth and profitability targets. We believe that by effectively applying these resources, we have developed proprietary innovations and intellectual property that will give us an early lead in our target markets and will enable accelerated growth over time.

Over the last 10 years, we believe we have been instrumental in achieving fundamental developments that have enabled key technology transitions in the automotive and industrial markets. We believe we are one of very few suppliers in the semiconductor industry to integrate proprietary, high-performance motor control algorithms into our motion control devices to achieve optimized BLDC motor performance. We remain one of the few suppliers that has developed multiple packaging technologies capable of operating at temperatures of up to 175 degrees Celsius and incorporating the passive components and high-current conductors required to produce high-efficiency, high-voltage sensor and power products. We were also one of the first in our industry to develop automotive grade xMR technology on silicon wafers, which enabled breakthrough advances in product performance. This advanced technology is a key enabler across our strategic focus areas in the automotive and industrial markets as automation and energy efficient markets continue to transition to xMR.

We augment our internally generated intellectual property through a mix of licensed intellectual property, partnering with industry experts, and through acquisitions. For example, the two businesses we acquired in the past four years provide leading technology, including IGD and TMR, which will expand our SAM, most notably in BEV, AI data center and energy infrastructure.

Our global team of highly skilled engineers has extensive semiconductor development experience, including expertise in analog design, digital design, test, and process technology. As of March 27, 2026, we had approximately 760 employees dedicated to research and development, with centers in the United States, Europe, South America, and Asia. The efforts of our engineering team and our strategic acquisitions have resulted in further strengthening our position in our target markets.

We have also made significant investments in our core engineering capabilities, including improvements in tools to support greater engineering efficiency, as well as electrical component, magnetic performance, and thermal distribution modeling. We believe these improved tools enable us to more accurately evaluate and predict the performance of our designs, resulting in accelerated time-to-market for our products and satisfaction of our customers. Additionally, we are strategically integrating advanced AI and automation into our research and development lifecycle to streamline the chip design process, significantly enhancing engineering productivity and accelerating the time-to-market for our innovative product portfolio.

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Our focus on meeting or exceeding the stringent automotive market safety and reliability requirements is fundamental to our research and development process. We anticipate that we will continue to make research and development investments in order to enhance our leadership position and expand our markets with innovative, high-quality products and services (as exemplified through our acquisitions of IGD and TMR technologies).

Process and Packaging Technology

Our product and technology development engineers have long-established expertise in designing mixed signal power and magnetic sensor ICs using proprietary semiconductor process technologies and intelligent packaging. By integrating these capabilities, we provide complete system solutions and robust performance required by the most stringent customers and automotive applications. These have the benefit of advancing the feature, function, and cost of ownership of our devices relative to those of our competitors. For example, we released a unique 120V and 175-degree Celsius capable BCD wafer technology designed to handle automotive voltage and temperature transients. This platform integrates high-density logic circuits and electrically erasable programmable read-only memory to enable configurable and embedded algorithms alongside various Hall-effect and xMR transducer technology on a single silicon wafer. These technologies are fundamental to the transition from 12V to 48V power supply required in the rapidly emerging HEV and BEV markets, and to the next generation of ADAS systems. These 48V and high-voltage capabilities are cornerstone technologies for our growth in xEV powertrain and ADAS safety systems, as well as in the rapidly expanding AI data center cooling and humanoid robotics markets. We further leveraged this leadership by industrializing our IGD portfolio with integrated transformers, providing a highly integrated, small-footprint solution for high-voltage power conversion for our global customers.

In choosing the process technology to be used to manufacture a new product, we seek to optimize the match between the process technology and the desired performance parameters of the product for our customers. Our current strategic semiconductor process innovations include the following:

Automotive Quality and Safety

We have developed, characterized, and qualified our wafer and package technologies to meet or exceed the rigorous automotive requirements that our customers demand. Robust development processes and guidelines have resulted in devices capable of exceeding the requirements of Automotive Electronics Council Q100 Automotive Grade 0 of 150 degrees Celsius, and our field failure rates are consistent with or better than customer requirements.

Integrated Transducers

One of our fundamental innovations is the integration of magnetic transducers and CMOS circuitry into one piece of silicon to create a complete, fully integrated system. Hall-effect elements are implanted in silicon, providing robust and low-noise solutions that are optimized for stress and temperature effects. Thin film, high-resolution xMR transducers are deposited directly on top of the low-noise bipolar and CMOS circuitry creating a more reliable solution than multi-chip solutions by reducing interconnects and solution area. To achieve the highest level of Automotive Safety Integrity Level (“ASIL”), we integrate xMR and Hall-effect transducers onto the same silicon to produce heterogeneous solutions capable of performing reliably in the most demanding automotive environments.

High-Voltage Technology

Our intellectual property, developed over decades of leadership in stringent automotive applications, combines advanced mixed-signal integration with proprietary high-voltage solutions. A key differentiator of our technology is the monolithic integration of 120V capable power transistors with embedded digital logic and precision analog circuits. This integration significantly reduces the bill of materials and shrinks the PCB for our customers while delivering the most efficient and quietest motor control solutions in the market. As the industry transitions to 800V+ architectures in both xEVs and AI data centers, we have leveraged our deep expertise in high-voltage materials and advanced isolation to develop and ship millions of specialized high-voltage packages. This proven capability in high-voltage packaging and sensing, where we have already deployed millions of current sensors and are rapidly scaling our IGD portfolio, represents a competitive strength and underscores our leadership in the global electrification and “Physical AI” (the integration of AI into physical machinery - such as robots, autonomous vehicles, and drones-enabling them to perceive, understand, and act within the real world) ecosystems.

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Advanced, Small Form Factor Integrated Packages

We continue to combine circuit design and process innovation with novel packaging solutions that improve performance and reliability while reducing solution footprint and our customers’ cost of ownership. Two decades of sensor package innovation have led to the development of a family of integrated systems in a package for magnetic current, position, and speed sensor ICs. By integrating a combination of a magnet, magnetic core, passive components, and our silicon integrated circuit in a single body, we are able to offer inventive magnetic sensors that reduce our customers’ needs to design complex magnetic models or complex interface circuits, solve electrical interference issues with external PCBs, and enable smaller and more cost-effective customer systems. The current sensors integrate specially designed lead frames to allow a high-precision, factory-programmed single package solution that provides a unique high-efficiency and high-voltage isolation product and can sense current for products plugged directly into a household electrical outlet or connected to an 800V automotive battery. Years of design and manufacturing refinement have led to the latest generation of power products that integrate passive components and power conversion capabilities into small packages to reduce PCB footprint, reduce electromagnetic noise, and improve efficiency in high-power systems. Our IGDs also incorporate a DC-DC converter, a small planar transformer, and a gate driver into a small form factor package. Through innovative package integration, these IGDs minimize parasitic capacitance and can significantly improve system-level efficiency in electrified vehicles, clean energy, and factory automation systems. We also believe we are one of only a few companies in our industry that have developed a broad portfolio of packages that are suitable for operation in automotive environments and 175-degree Celsius temperatures.

Intellectual Property

We consider the strength of our intellectual property portfolio to be a significant competitive advantage. Our intellectual property includes patented inventions, trade secrets, accumulated technical know-how and trademarks. As of March 27, 2026, we owned approximately 1,860 active patents, including 1,005 U.S. patents (with expiration dates between 2026 and 2044), with approximately 440 pending patent applications, including 250 U.S. patent applications.

We market our products worldwide under the “Allegro” name. We either hold or have applied for trademarks in all jurisdictions where we do significant business.

Competition

The semiconductor industry, particularly the market for high-performance analog mixed-signal semiconductors, is highly competitive. Although no one company competes with us across all of our product lines, we face significant competition within each of our business areas from both domestic and international semiconductor companies. Our primary competitors include a broad spectrum of global semiconductor designers and manufacturers, ranging from large-scale diversified entities to specialized participants focused on specific sensing and power management technologies.

Our ability to compete successfully against these companies depends on elements both within and outside of our control. Some of our competitors have substantially greater financial, technical, marketing, and management resources than we have. These competitive advantages may enable them to respond more quickly to new or emerging technologies or changes in customer requirements, or better position them to withstand adverse economic or market conditions.

We believe we can successfully compete against these organizations in our target markets by leveraging our design and market expertise and leadership positions, proprietary manufacturing processes, custom packaging capabilities, and close customer relationships. In addition, we compete in our target markets to varying degrees based on several competitive factors, including:

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time to market;

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system and application expertise;

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product quality and reliability;

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quality systems and support;

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product features and performance;

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proprietary technology;

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production capacity; and

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solution price.

We believe we currently compete favorably with respect to these factors. However, we cannot assure you that our products will continue to compete favorably or that we will be successful in the face of increasing competition from new products and enhancements introduced by existing competitors or new competitors entering our markets. See “Risk Factors—Risks Related to our Business and Industry—We face intense competition and may not be able to compete effectively, which could reduce our market share and decrease our net sales and profitability.”

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Seasonality and Market Demand

Our business exhibits some seasonality. Historically, our net sales have generally been higher in the second half of the fiscal year than in the first half. We have also consistently experienced a seasonal decline in automotive in our fourth fiscal quarter, which is largely attributable to the Chinese New Year and its impact on customer demand in China in the quarter. However, various factors, such as market conditions, the cyclicality of the semiconductor industry, new product introductions, and the supply chain environment, can impact the effects of seasonality on our business.

Employees and Human Capital Resources

Our employees are our most valuable assets and contribute to Allegro’s success. We have a skilled and experienced workforce across research and development, operations and quality, sales and marketing and our general and administrative support functions. Together as “One Allegro,” our employees are instrumental in driving operational execution and quality excellence, delivering strong financial performance, advancing innovation, and building trusted customer relationships to help solve our most complex problems.

As of March 27, 2026, we employed approximately 4,250 full-time employees, including 760 in R&D, 2,950 in operations and quality (the majority of whom are located at AMPI), 235 in sales and marketing and 305 in general and administrative roles. We consider our relationship with our employees to be good, as we have never experienced a labor-related work stoppage. None of our employees are represented by a labor union.

The success and growth of Allegro’s business are dependent in large part on our ability to attract, retain, and develop talented, high-performing employees from various backgrounds at all levels of our organization. We continue to invest in our centers of excellence and global design centers to attract top analog design talent. We maintain a technical ladder across our engineering disciplines to provide a robust career path. Additionally, we offer a specific Field Applications Engineer training in partnership with sales and other departments to educate teams on our extensive product portfolio.

As of March 27, 2026, approximately 2,350 of our employees held university and graduate-level degrees, of which approximately 1,500 of these employees were located outside of our factory locations. For our research, engineering, and production management positions, we require employees with university and graduate-level degrees. Globally, the demand for employees with such levels of education is high and competitive.

To succeed in these conditions, Allegro implements key recruitment and retention strategies, objectives and effectiveness measures as part of the overall management of our business. These core strategies are advanced through the following programs, policies and initiatives:

Competitive Pay and Benefits. Allegro’s compensation programs are designed to align the compensation of our employees, who operate in a highly competitive and technologically challenging environment, with Allegro’s business performance and to provide the proper incentives to attract, retain and motivate employees to achieve superior performance. The structure of our compensation programs provides incentive earnings for both short-term and long-term performance. Specifically, and as applicable to individual employees and roles:

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We provide short-term incentive and equity awards based on both business and individual performance.

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All non-sales employees participate in one of our annual cash incentive programs, allowing them an opportunity to be rewarded with compensation that aligns with both the business performance of Allegro and their own individual performance.

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All sales and field applications positions participate in our annual sales incentive plan, allowing them to earn additional cash incentives based on the achievement of specific sales metrics designed to drive our financial performance.

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We also provide an opportunity for many of our global employees to earn equity awards. Additionally, in the U.S. and the United Kingdom, we offer an employee stock purchase plan to our non-executive employees, which allows them to purchase shares of Allegro stock at a discounted price. This stock purchase plan further aligns our employees’ financial interests with the performance of the business and the interests of our stockholders.

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We purchase compensation data from external compensation and benefits consulting firms to ensure we provide competitive compensation in each of the geographic locations in which we operate.

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We align our executives’ annual and long-term equity compensation, in the form of performance-based restricted stock units (“PSUs”) and time-based restricted stock units (“RSUs”), with our stockholders’ interests by linking realizable pay with Allegro’s stock performance and other key business and financial operating metrics.

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We provide comprehensive benefit options designed to retain our employees and support their families in all areas of health and wellness.

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We provide social community benefits, including a global charitable gift matching program, and a global volunteer policy, both of which help our employees give back to the local communities in which we operate.

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Employee recruitment, retention and development. Allegro works diligently to attract the best available talent from a broad array of sources to meet the current and future demands of our business. We have established relationships with world-class colleges and universities, professional associations and industry groups to proactively attract talented and capable new hires. We also utilize social media, local job fairs and educational organizations to find motivated and responsible candidates who represent a variety of backgrounds, perspectives and experiences. We have also made strides in expanding the breadth of qualified talent pools we draw from to find candidates for management positions, while building internal resources to support our employees, regardless of background, to qualify for future leadership openings. Allegro has a strong employee value proposition that leverages our technology leadership, collaborative working environment, shared sense of purpose and culture, and the desire to do the right thing to attract talent to our Company.

We closely monitor employee turnover rates, as our success depends upon retaining and investing in our highly trained manufacturing and technical staff. Allegro strives to decrease employee-initiated voluntary turnover and increase employee retention through a combination of competitive compensation, individual developmental opportunities and personal career enrichment and growth. We strive to provide an inclusive culture where employees can come to work, feel a sense of belonging and achieve their personal best. We provide a Flex@Allegro program to allow our employees flexibility as to where and how work gets accomplished. This flexible work arrangement enables our employees to achieve better work and life balance, and helps us to attract and retain talent. Our retention at the technical, professional and managerial levels is high, and our voluntary turnover remains lower than industry averages based on benchmark data.

Employee Engagement. At Allegro, we strive to create a positive, values-based culture and high employee engagement where our employees can bring their best to work. In fiscal year 2026, we launched our third annual global employee engagement survey to all employees, and achieved a high participation rate, indicating employees see value in sharing their perceptions and sentiments about working at Allegro. Our engagement score for fiscal year 2026 is on par with industry benchmarks, and the survey found that the large majority of employees would recommend Allegro as a great place to work and are proud to work at Allegro. In addition, the majority of employees feel that the products and services we offer are as good or better than our competitors, driving pride in the organization and passion for what we build and deliver.

Embracing Innovation. We are strategically investing in, developing, and deploying AI, machine learning, and automation solutions to our global workforce, designed to accelerate our “Innovation with Purpose” mission. By integrating advanced AI tools into our chip design lifecycle, manufacturing operations, and administrative functions, we are empowering our engineers and professionals to achieve greater operational efficiency and shift their focus toward high-value, disruptive product development. We believe this commitment to an AI-enabled workforce allows us to maximize our human capital potential, driving faster time-to-market for our innovative solutions while maintaining a disciplined approach to organizational growth.

Information about our Executive Officers. The following table sets forth certain information regarding our executive officers as of May 21, 2026:

Michael C. Doogue was appointed President and Chief Executive Officer and as a member of our Board, in February 2025. Prior to that, he served as our Executive Vice President, Chief Technology Officer, since being named as the Company’s first Chief Technology Officer in September 2022. Mr. Doogue joined Allegro in 1998 as a Design Engineer, facilitating the development of Allegro’s innovative speed and current sensor ICs. Mr. Doogue has also served in various leadership positions at Allegro, including as Design Manager from 2002 to 2006, Director of Strategic Marketing from 2006 to 2011, Business Unit Director of Linear Current Sensors from 2011 to 2016, Vice President of Advanced Sensor Technologies from 2016 to 2019, and as Senior Vice President of Technology and Products from 2019 to 2022. Mr. Doogue holds over 75 semiconductor-related U.S. patents. Mr. Doogue received a B.A. in Physics from Colby College in 1997 and a B.E. in Electrical Engineering from Dartmouth College in 1998. In 2007, Mr. Doogue completed the Stanford Executive Program at the Stanford University Graduate School of Business.

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Derek P. D’Antilio has served as our Executive Vice President, Chief Financial Officer and Treasurer since he joined Allegro in January 2022. Mr. D’Antilio currently serves on the board of directors of Polar as a representative of Allegro. Prior to joining Allegro, Mr. D’Antilio served as the Chief Financial Officer of a Summit Partners Portfolio Company and helped lead the sale and recapitalization of the company. From February 2019 to March 2021, he served as the Chief Financial Officer of IDEX Biometrics, a publicly traded and global fabless semiconductor company, where he played an instrumental role in leading a Nasdaq listing and preparing the company to scale its production. Prior to IDEX Biometrics, Mr. D’Antilio spent eight years at MKS Instruments, a global equipment and service provider to semiconductor and industrial markets and held numerous leadership roles, including Vice President & Corporate Controller, where he oversaw global accounting and reporting, financial planning and analysis, and treasury. Earlier in his career, Mr. D’Antilio was a CPA and CMA in public accounting and served as an audit manager at PricewaterhouseCoopers LLP. Mr. D’Antilio holds a B.S.B.A. in Accounting from Salem State University, an M.B.A. from Babson College and has attended executive education programs at the University of Chicago and University of Pennsylvania.

Sharon S. Briansky has served as our Senior Vice President, General Counsel and Secretary since she joined Allegro in December 2021. Prior to joining Allegro, Ms. Briansky served as the Vice President, Deputy General Counsel and Secretary at Thermo Fisher Scientific (“Thermo Fisher”) from 2017 to 2021. Prior to that she served as Vice President, Associate General Counsel at Thermo Fisher from 2005 to 2017. Ms. Briansky received a B.A. in Political Science from the University of North Carolina in 1995 and a J.D. from Boston University School of Law in 1998.

Troy T. Coleman joined Allegro as Senior Vice President, General Manager, Products, in October 2025 with over 25 years of semiconductor industry experience. Prior to joining Allegro, Mr. Coleman served as Vice President and General Manager, Linear Power at Texas Instruments from January 2023 to September 2025 and Vice President and General Manager, Power Switches, Interface, and Lighting at Texas Instruments from April 2018 to January 2023. Mr. Coleman first joined Texas Instruments in June 1999 in the technical sales organization, holding progressively senior positions within the sales, marketing and products organizations. Mr. Coleman holds a Bachelor of Science in Electrical Engineering from Texas A&M University.

Erin E. Hagen joined the Company as our Senior Vice President and Chief Human Resources Officer in May 2024. Prior to joining Allegro, Ms. Hagen served as Global Human Resources Business Partner for Cabot Corporation, a leading global specialty chemicals and performance materials company, from January 2021 until May 2024. Prior to that, she served as Chief Human Resources Officer for Wind River Environmental, LLC, a septic, grease, and wastewater services company, from 2019 through 2021. From 2014 through 2019, Ms. Hagen worked for OMNOVA Solutions Inc., a developer and manufacturer of emulsion polymers, specialty chemicals and building products in roles of increasing responsibility within the human resources organization. Ms. Hagen holds an M.S. in Positive Organization Development and Change from Case Western Reserve University and a bachelor’s degree in organizational communications from Central Michigan University.

Ian Kent has over 25 years of operational experience in the semiconductor industry and was named Allegro’s Senior Vice President, Operations in January 2026. He joined Allegro in September 2023 and has held progressively senior roles in operations, including Senior Director of IC Packaging, and most recently, Vice President Operations. Prior to joining Allegro, he served as Vice President, Operations at Renesas, Inc. from August 2021 until September 2023. Before joining Renesas, he held technical leadership positions at Dialog Semiconductor beginning in August 2008 before its acquisition by Renesas in 2021. Mr. Kent holds an Electronic Engineering Technology apprenticeship and HNC from The University of Wales, Pontypridd.

Richard A. Madormo joined the Company as our Senior Vice President of Worldwide Sales in March 2025 with over 25 years of sales experience in the semiconductor industry. Prior to joining Allegro, Mr. Madormo served as the SVP, Global Sales and Marketing at Wolfspeed, Inc. (“Wolfspeed”), having joined the company in August 2018 as Vice President of North American Sales. Before joining Wolfspeed, Mr. Madormo held sales leadership positions at Intel Corporation and Altera Corporation. Mr. Madormo holds a degree in electrical engineering technology from The University of Akron.

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Environmental and Occupational Health and Safety Regulation

We recognize the importance of protecting the environment and the health and safety of our employees, customers, and communities. Our Environmental Health and Safety (“EHS”) Policy outlines policies and training programs that are designed to promote and protect employee safety. Our EHS teams oversee workplace conditions for our employees. All Allegro EHS policies and procedures are developed in accordance with applicable laws and regulations. AMPI is certified to ISO 14001 for environmental management systems and ISO 45001 for occupational health and safety management systems.

Our operations are subject to various federal, state, local, international, and non-U.S. laws and regulations governing pollution and environmental protection and occupational health and safety, including those related to hazardous and toxic materials, product composition, and the investigation and cleanup of contaminated sites. This includes sites we currently or formerly owned or operated, due to the release of hazardous materials, regardless of whether we caused such release. In addition, we may be strictly liable for joint and several costs associated with investigation and remediation of sites at which we have arranged for the disposal of hazardous wastes if such sites become contaminated, even if we fully comply with applicable environmental laws and regulations. We are also subject to various federal, state, local, international, and non-U.S. laws and regulations relating to occupational health and safety. Any failure on our part to comply with these laws and regulations, including new laws or new interpretations of existing ones, may subject us to significant fines or other civil or criminal costs, obligations, sanctions or property damage or personal injury claims, or suspension of our facilities’ operating permits. In addition, in the event of an incident involving hazardous materials, we could be liable for damages and such liability could exceed the amount of any liability insurance coverage and the resources of our business.

We face increasing complexity in our product design and procurement operations due to the evolving nature of environmental laws, regulations, directives and standards, as well as specific customer requirements. These laws, regulations, directives, and standards have an impact on the material composition of our products entering specific markets. For example, the European Union (“EU”) adopted its Restriction of Hazardous Substance Directive (“RoHS”) legislation, EU Directive 2002/95/EC (RoHS) and 2011/65/EU (RoHS II), amended by 2015/863/EU, which took effect in July 2019. The EU also adopted the European Regulation on Registration, Evaluation, Authorization and Restriction of Chemicals in 2007, which calls for the progressive substitution of dangerous chemicals in manufacturing. In 2006, China first published its RoHS equivalent, the Administrative Measures on the Control of Pollution Cause by Electronic Information Products. This regulation was revised in 2016 when China enacted the Administrative Measures on the Restrictions of the Use of Certain Hazardous Substances in Electrical and Electronic Products Regulations, which expanded the scope of the 2006 requirements and is designed to restrict additional hazardous substance in certain electrical and electronic products. In addition, any business selling products to consumers in California containing certain listed chemicals or substances is subject to California Proposition 65 (officially known as the Safe Drinking Water and Toxic Enforcement Act of 1986), which requires disclosure of the listed chemical and potential health risks. In addition to these regulations and directives, we may face costs and liabilities in connection with product take-back legislation, which holds manufacturers responsible for the collection and proper disposal of their products discarded by their customers. There are also increasing regulations regarding the use of green marketing claims, which may also affect our product design and procurement operations. Non-compliance with current or future regulations or directives could restrict our ability to expand our business or require us to modify processes and/or materials or incur other substantial expenses which could harm our business.

Although we incur costs to comply with the provisions discussed above and other applicable federal, state, local, international and non-U.S. laws and regulations relating to environmental protection in the ordinary course of our business, such costs have not materially affected, and are not presently expected to materially affect, our capital expenditures, earnings or competitive position.

Available Information

We file annual, quarterly and current reports and any amendments to those reports, proxy statements and other information with the Securities and Exchange Commission (“SEC”). Documents we file with the SEC are available free of charge on our website at https://investors.allegromicro.com/financials/sec-filings, as soon as reasonably practicable after such material is filed with the SEC. The information included on or available through our website is not part of this or any other report we file with the SEC. Any document that we file with the SEC is available on the SEC’s website at www.sec.gov.